News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Interview
13 December 2024

Keynote: Sparking a new chemical reaction at the BU with...

Yuichiro Akita, President of the Berne Union and general manager, international and strategic policy, at Nippon Export and Investment Insurance (NEXI), explains his vision for...

Perspective
20 December 2024

2024: Export finance trends

TXF have wrapped up the major trends in the export finance market in 2024. There's a few to keep an eye on next year too..